In a message dated 7/26/2007 01:28:55 Pacific Daylight Time,
magnus@rubidium.dyndns.org writes:
sy cooling flange. On another board we glued a nut to the top of the BGA
and hanged 50-70 kg of it and while the board was clearly bent the BGA was
still firmly hooked to it. Now that's the difference between a few um of
gold
too much or not.
There are other cases where the gold-plating is not an issue.
This has been covered in public sources, so a dig around would give some
indication.
Cheers,
Magnus
Hi Magnus,
I've had a board with what the manufacturer called "black pad" syndrom: the
BGA literally popped off by just bending the PCB sufficiently. The solder
joint was useless.
Is this caused by the problem you described?
Also, what do you think is a better process: gold-flash, or gold-immersion?
bye,
Said
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Hi Said,
Magnus might be busy until after the weekend.
After fixing my Rb - Thanks!!! - and collecting a few antennas, Magnus
headed for the wilderness with a car full of beer and music festival
stuff.
btw,
Is anyone running a FE-5608A 19"-rubidium? The main internal parts are a
5MHz FE-2204A VCXO, and the FE-5607E rubidium package.
--
Björn
On Thu, July 26, 2007 20:51, SAIDJACK@aol.com said:
Hi Magnus,
I've had a board with what the manufacturer called "black pad" syndrom:
the
BGA literally popped off by just bending the PCB sufficiently. The solder
joint was useless.
Is this caused by the problem you described?
Also, what do you think is a better process: gold-flash, or
gold-immersion?
bye,
Said
************************************** Get a sneak peek of the all-new AOL
at
http://discover.aol.com/memed/aolcom30tour
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From: SAIDJACK@aol.com
Subject: Re: [time-nuts] HP 5370B low frequency modulation
Date: Thu, 26 Jul 2007 14:51:27 EDT
Message-ID: d6b.b2db71f.33da472f@aol.com
Said,
Hi Magnus,
I've had a board with what the manufacturer called "black pad" syndrom: the
BGA literally popped off by just bending the PCB sufficiently. The solder
joint was useless.
Is this caused by the problem you described?
It is the only reason I know if you use a propper soldering profile while
soldering the BGA.
Also, what do you think is a better process: gold-flash, or gold-immersion?
No preference. The important thing is the relative amount of gold, and that
relates to the thickness of gold. A good process on gold-plating is crutial
regardless of method.
Cheers,
Magnus
From: Björn_Gabrielsson bg@lysator.liu.se
Subject: Re: [time-nuts] HP 5370B low frequency modulation
Date: Thu, 26 Jul 2007 22:23:09 +0200 (CEST)
Message-ID: 62287.87.227.52.225.1185481389.squirrel@webmail.lysator.liu.se
Björn,
Magnus might be busy until after the weekend.
Indeed I was.
After fixing my Rb - Thanks!!! - and collecting a few antennas, Magnus
headed for the wilderness with a car full of beer and music festival
stuff.
Indeed. I am now at my friends place relaxing after the festival and just
hanging around.
Fixing the Rb was reeealy a nice thing. It took some creativity as the ebayed
spare part was not a perfect match. Some creative rewiring made it lock and
stay stable. So cool. Björn's house is such a friendly place to be, so it is
worth doing a 400 km trip (200 km each way).
btw,
Is anyone running a FE-5608A 19"-rubidium? The main internal parts are a
5MHz FE-2204A VCXO, and the FE-5607E rubidium package.
I think I saw someone on the list recently...
Cheers,
Magnus