I have something of a follow up question. How good is the isolation inside
these devices (74LVC, SOT-23 package) between gates?
Maybe it's just me ... but I wouldn't trust the isolation to be good.
Apart from on-die coupling, they share the same power/ground leads, however
short they are. So just getting power and ground from the board onto the
die, they would be corrupted by what happens in the other gate and its load
(L*di/dt).
Andy
Hi
The isolation in the package is likely better than the (practical) layout you will
do to mate up with them. In fact, the single gate stuff probably does a better job
of isolation than the multi gate stuff, simply because you can spread it out on
the board.
In the case of dividing by two, there are single gate flip-flops that are Q bar output
rather than Q. That eliminates the second single gate package in this design. Yes, there
are far to many different numbering systems. Finding this or that can be a massive
pain.
======
If power is an issue, the real trick is to find a family that is happy running on a low(er)
supply voltage. Some of this stuff will toggle at 20 MHz with very low supply. Often
the inputs are “high voltage tolerant” even with those low supplies.
Bob
On Jun 8, 2015, at 8:30 PM, Dan Watson watsondaniel3@gmail.com wrote:
I have something of a follow up question. How good is the isolation inside
these devices (74LVC, SOT-23 package) between gates?
Let's say I have a 20MHz TCXO. I want to square up the output signal and
divide by two. Easy, just a buffer or inverter and a flip flop. But looking
at the pinout of the 74LVC1G175 (D flip flop) it doesn't have a Q not
output. So now I need a second inverter to make it toggle. The 74LVC2G14
includes two schmitt inverters in the package, but will isolation inside
the device be good enough to use it for two separate functions at 20 and 10
MHz?
Just from a layout perspective using three devices instead of two would be
easier. However the thing will be battery powered, so I'd like to save the
power if possible.
Thanks
Dan
On Mon, Jun 1, 2015 at 6:13 PM, Andy AI.egrps+tn@gmail.com wrote:
The gates on that page
http://hyperphysics.phy-astr.gsu.edu/hbase/electronic/trangate.html
use bipolar transistors. The 74LVC parts are CMOS. There are various
effects caused by that difference.
And those examples have vastly inferior control over input switching
levels, compared to just about any well made digital IC from the last half
century. (Funny to think that it has been half of a century!)
2N2222 type transistors might have switching delays upwards of 100 ns
(depending on load), whereas the LVC parts switch in the 1-5 ns range.
"On the other hand: A well designed discrete circuit can beat a general
purpose integrated circuit in almost all performance measures."
Some performance metrics would be hard to beat with even a well designed
discrete circuit. On-die capacitance and inductance tends to be much
smaller than any discrete circuit can achieve.
Andy
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Hi
The question is always “good isolation compared to what?”.
If you are expecting 180 db of isolation on a SOT-23 package at 10’s of MHz, it’s
not going to happen. It’s also not going to happen with a practical pc board layout
even without the SOT-23 involved.
If something around 120 db is “good isolation”, then yes you can do that with a
pair of the SC-70 parts and a good layout. In this case the test was at 10 MHz.
Bob
On Jun 9, 2015, at 12:26 AM, Andy AI.egrps+tn@gmail.com wrote:
I have something of a follow up question. How good is the isolation inside
these devices (74LVC, SOT-23 package) between gates?
Maybe it's just me ... but I wouldn't trust the isolation to be good.
Apart from on-die coupling, they share the same power/ground leads, however
short they are. So just getting power and ground from the board onto the
die, they would be corrupted by what happens in the other gate and its load
(L*di/dt).
Andy
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To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts
and follow the instructions there.